thin film analyzer
chip filmthin film internchip overviewmagnetic field schema chipsample holder chipmagneet optie thin film

TFA-Thin Film Analyzer for µm and nano layers

Revolutionary physical properties thin film characterization system

Physical properties of thin films differ from bulk material!

  • Parasitic surface effects are much stronger due to smaller dimensions and high aspect ratios.
  • Quantum confinement

The LINSEIS Thin Film Analyzer is the perfect tool to characterize a broad range of thin film samples in an extremely comfortable and fast way. It is an easy to use, single stand alone system and delivers highest quality results using a patent pending measurement design.

The big advantage of this system is the simultaneous determination of a broad range of physical properties within one measurement run. All measurements are take in the same (in-plane) direction and are very comparable.

Main System Characteristics:

  • High quality, easy to use characterization system for thin films (nm to µm range).
  • Temperature dependent measurements (-170 to +200°C – optional 300°C).
  • Easy sample preparation and handling.
  • Chip based measurement device with pre structered chips as consumeables.
  • High measurement flexibility (sample thickness, sample resistivity, deposition methods).
  • All measurements are taken from same sample in one run.
  • It is possible to measure samples with metallic behavior as well as ceramics or organics.

thin film brochure pdf

Productbeschrijving

Basic thin film device

The thin film analyzer consists of a measurement chamber, vacuum pump, basic sample holder with included heater, measurement electronics, system integrated lock-in amplifier, electronics and evaluation software for 3w-method, PC and LINSEIS Software package. The design is optimized to measure following physical properties:

  • ρ – Electrical Resistivity / σ – Electrical Conductivity
  • S – Seebeck Coefficient
  • ε – Emissivity (depends on sample properties)

Transient package

Consisting of system integrated lock-in amplifier, electronics and evaluation software for 3 Omega method. The design is optimized for measuring the following parameters:

  • λ – Thermal Conductivity
  • cp – Specific Heat

Magnetic package

Optional Electromagnet to measure the following parameters:

  • AH – Hall Constant
  • μ – Mobility (calculation depending on model)
  • n – Charge carrier concentration (calculation depending on model)

Specifications

Temperature range*: RT up to 200°C
 optional -170°C up to 300°C
Sample thickness: From nm to µm range (depends on sample)
Measurement principle: Chip based (pre-structured measurement chips, 15 pcs. per box)
Deposition techniques: Include: PVD (sputtering, evaporation), ALD, Spin coating, Ink-Jet Printing and more
Measured parameters: Electrical Conductivity / Resistivity
Seebeck Coefficient
Optional: Thermal Conductivity (3 Omega)
Specific Heat
Hall Constant / Mobility / Charge carrier conc.
Electromagnet up to 1 T
Vacuum: up to 10E-5mbar
Electronics: Integrated
Interface: USB
Measurement range
Thermal Conductivity 0.05 up to 200 W/m∙K
Electrical Resistivity 0.05 up to 1 ∙ 10E6S/cm
Seebeck Coefficient 5 up to 2500 μV/K
Repeatability & Accuracy
Thermal Conductivity ± 10% (for most materials)
Electrical Resistivity ± 6% (for most materials)
Seebeck Coefficient ± 7% (for most materials)

Thermoelectric devices

A typical application is the characterization of thin films made out of thermoelectric materials. A lot of research is done to improve the efficiency of thermoelectric devices.

Integrated devices

For the development and design of new and robust integrated devices like sensors or microchips, the semiconducting industry needs to know a lot about the physical properties of the used films. For example for the heat management or the electric insolation of such devices.

 

Thermal barrier coatings

Another interesting field for thin films are thermal barrier coatings as they are used in aircraft engines. Many new materials have been developed and characterized, especially in regard to their thermal behavior.

Tribological stress

The last application example is the determination of material parameters for thin films used in tools. The understanding is very important to avoid wear due to tribological stress to ensure an extended product life cycle.